Vision 2021
Daphne Bakermans
easics invites you to join us at the Vision trade fair in Messe Stuttgart, Germany 5-7 October 2021. You can meet us at Booth 8B21. Here you can find us showcasing our leading edge technology, such as nearbAI on FPGA, or we can have a …
OCM Spectronet conference
Easics participated at the Spectronet conference in Karlsruhe on the 12th of march. There is a lot of potential in the food and pharmaceutical industry in combining spectrometry and AI. Easics took the opportunity to showcase his deep learning on FPGA demo. The demo can classify and …
ASIC design for ESA
admin
Caeleste, Easics and SELEX Galileo signed an ESA contract for the Development of a Prototype ASIC for Large Format NIR/SWIR Detector Array The European consortium formed by the companies Caeleste (Belgium), easics (Belgium) and SELEX Galileo (United Kingdom) won the European Space Agency ’s call for …
DSP Valley Newsletter
Easics’ deep learning live demo at the WoTS 2018 fair (c) DSP Valley From 2 till 5 October, easics participated in the World of Science and Technology exhibition in Utrecht, organized by FHI. At the World of Electronics section of the fair easics was proud …
Vision
Date: 06/11/2018Location: Messe Stuttgart, Messepiazza 1, 70629 Stuttgart Vision 6-8 November 2018 Easics invites you to join us at the Vision trade fair in Messe Stuttgart, Germany 06-08 November. You can meet us at Booth 1J43. Contact us for free registration. If you would like to …
New “Leica M” Camera
Ilse de Moffarts
Easics has modeled, implemented and verified proprietary digital pixel processing algorithms for CMOSIS’ novel intelligent CMOS image sensor chip for the “Leica M” camera. Easics’ model-based approach resulted in first time right silicon. Easics created a high-level model of the proprietary digital noise cancellation and …