Leica M camera
Leica M Camera
Limited specification available for the data path of the CMOSIS “Leica MAX 24MP CMOS Sensor” chip
Frequent specification changes
Proprietary digital noise cancellation and correlated double sampling algorithms
Need for a fast time-to-market and keep the budget under control.
This approach is part of easics’ mixed-signal ASIC design toolbox. It is ideally suited for datapaths and signal processing, and is complemented with techniques such as SystemC and Verilog-AMS modeling and in-the-loop simulation. Easics creates the model in the high-level language that the customer prefers, such as C++ / SystemC, Matlab, Python, or Ruby. This fits nicely in easics’ vision of maximally using software techniques and high levels of abstraction for chip design and verification. Easics uses similar high-level modeling techniques for advanced FPGA development.
What our customers say about our services
“Radiation-tolerant companion chip for high-end scientific image sensors”
Although CMOS made integration of image sensors in cameras easier, the wide variety of vendors and the variability in controlling signals and data format is still a difficulty for camera manufacturers. As part of Esa contracts, easics and Caeleste have developed a radiation-tolerant programmable companion chip for image sensors, primarily targeting infrared imagers with the possibilty to interface CMOS as well as CCD visible light sensors.
The chip is targeted towards future space science and earth observation missions and operates at temperatures as low as 77 Kelvin. On top of data formating and programmable sensor driving, the device also includes necessary ‘housekeeping’ electronics such as biasing DACs, linear regulators, bandgap and temperature sensors.
“Outstanding in-house competence”
In 2017, easics and imec proudly look back on 5 years of partnership in the areas of ASIC design and IP. So far, there have been 3 design projects from in different technology nodes, where easics has proven to be a supplier with outstanding in-house competence of digital design.
This is a fundamental element for our objective of offering complete full-turnkey projects. Our end-customers with easics involvement range from small startups to large multi-national electronic firms, from which we regularly receive very positive feedback. A particular strength of easics is their capability of thinking at on system level, in a wide array of application domains, including imaging, networking and embedded code. Easics is located only a stone’s throw away from the imec headquarters, allowing for very efficient collaboration. It was great to contribute together with easics to the Leuven.inc Visionary seminar on blockchains, which achieved a record breaking number of visitors. We are looking forward for the next 5 exciting years with easics.
Rosa Maria Vinella
“Skilled and competent partner”
With easics we found a skilled and competent partner for the design of the digital core of our sensors’ readout. We appreciate their commitment to on time delivery and support during all phases of the development. easics has proven to deliver high-quality and reliable design compliant with our custom demands.
“Very good atmosphere and a lot of expertise”
A call to DSP Valley brought us to easics who stood out for their very solid and competitive offer. During our first visit it was immediately clear that easics constructively helps to come up with a technical solution fit for the specific needs of the customer. Hence the collaboration with easics went very smoothly and pleasantly. Drawing up specifications together, the technical provisional reviews, as well as the support afterwards took place in a very good atmosphere and were handled with a lot of expertise.